Adhesives for Binding applications Substrates: Fiber to Fiber

230

Adhesive Technologies

Available Applicators: PRO100, PRO200, HD350, MT500, PT500

Quick Overview


    Heat Resistance: 150ºF/66ºC
    Viscosity at 350°F/177°C: 15000
    Shear tensile pine, psi: 660
    Adhesion to Polycarbonate: 73 psi
    Working time range: 30-40 seconds
    Available forms: 110, 210
    Color: Clear
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Details

Formula 230 is a clear general purpose, production quality hot melt, capable of bonding plastics and porous substrates as well as some polyolefins.

Additional Information

Manufacturer: Adhesive Technologies
For More Information on the Adhesives for Binding applications Substrates: Fiber to Fiber, [Click Here] to Link to Manufacturer Web Site
 
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